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Rework Equipment×ビオラ - List of Manufacturers, Suppliers, Companies and Products

Rework Equipment Product List

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"BGA Rework / BGA Reballing" *Available from just one unit!

Over 50,000 rework achievements for BGA with a pitch of 0.35 to 1.27mm! Even for just one piece, you can trust us with circuit boards that have underfill applied!

Our company performs "BGA rework and reballing" using IPC-recommended IR rework equipment (7 units owned). We have a track record of reworking over 100,000 BGA components with pitches ranging from 0.35 to 1.27mm, as well as reballing over 50,000 BGA components with ball diameters from Φ0.2 to 0.76mm. We can also accommodate copper core balls. We can handle requests starting from just one piece, and we are capable of working on circuit boards with underfill applied, as well as replacing QFN and connector components. We can also address components that are difficult to replace. Please feel free to consult with us. 【Features】 ■ BGA and QFN Rework - Over 100,000 BGA rework achievements with pitches from 0.35 to 1.27mm - Achievements with 1,300 special QFN components - Capable of handling difficult-to-replace components - Analysis of soldering conditions using X-ray observation equipment with CT functionality ■ BGA Reballing - Over 50,000 reballing achievements for BGA components with ball diameters from Φ0.2 to 0.76mm - Capable of handling components with underfill applied - Can manage the entire process from BGA removal to reballing to rework *For more details, please refer to the PDF document or feel free to contact us.

  • Company:ビオラ
  • Price:Less than 10,000 yen
  • Soldering Equipment
  • Dedicated IC
  • Prototype Services

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[Information] Introduction to IR Method BGA Rework System

Detailed information about the BGA rework system with a global cumulative sales volume of 7,000 units.

This is an introduction document for the IR method BGA rework systems "IR550A" and "IR/PL650A" owned by Viola Corporation. It covers issues related to lead-free rework using hot air, comparisons between hot air methods and ERSA IR heaters during BGA rework, and various advantages of infrared heating. [Contents (excerpt)] ■ ERSA IR/PL IR Rework Station ■ Issues with lead-free rework using hot air ■ Comparison of hot air methods and ERSA IR heaters during BGA rework ■ Advanced technology from ERSA ■ RPC Reflow Observation Camera ■ Various advantages of infrared heating, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Processing Contract
  • Other contract services

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Biola Corporation - Introduction of Main Equipment

Possesses lead-free compatible dynamic IR rework systems, among others.

We would like to introduce our company's "main equipment" that performs general electronic device repairs as well as BGA repair and rework. The "HR600" is equipped with a super high-efficiency hybrid heater, which is an evolution of the IR heater, and features an automatic component placement function through image processing, enabling fully automated rework operations. The modular type IR rework system "IR650A" supports safe rework operations in a lead-free environment and can handle a wide range of applications from large lead-free boards with high thermal capacity to delicate mobile phone boards and small PC boards, allowing for safe rework operations with simple operating procedures. Additionally, we possess lead-free compatible rework systems like the "IR550A," which guarantees uniform heating that was difficult with traditional hot air methods, and the X-ray observation device "FX-300tRX" with CT functionality. 【Main Equipment】 ■ HR600 Fully Automated Rework System ■ IR650A Rework System ■ IR550A Rework System ■ Hybrid Rework System ■ X-ray Observation Device FX-300tRX with CT Functionality *For more details, please refer to the PDF document or feel free to contact us.

  • X-ray inspection equipment
  • Printed Circuit Board
  • Circuit board design and manufacturing

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BGA rework

If it's about BGA rework, leave it to us! We will introduce the work process.

Our company performs "BGA Rework and Reballing" using IPC-recommended IR rework equipment (7 units). "BGA Rework" refers to the process of removing a BGA mounted on a circuit board and installing a new BGA. The process involves removing the BGA from the circuit board, cleaning the solder left on the pads (lands) of the circuit board, applying flux or solder paste, placing the BGA, heating it with an IR heater, and joining the solder balls. Finally, the soldering condition is checked using an X-ray inspection machine. If you need BGA rework, please leave it to us. We have a track record of reworking over 100,000 units of BGA with pitches ranging from 0.3 to 1.27 mm. We are here to assist in rescuing discarded circuit boards. 【Process】 ■ Removal: Remove the BGA from the circuit board ■ Cleaning: Remove the solder left on the pads (lands) of the circuit board ■ Placement: Apply flux or solder paste, then place the BGA ■ Heating: Heat with an IR heater to join the solder ■ X-ray Inspection: Check the soldering condition with an X-ray inspection machine *For more details, please refer to the PDF document or feel free to contact us.

  • Company:ビオラ
  • Price:Less than 10,000 yen
  • Circuit board design and manufacturing
  • Contract manufacturing

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Introduction to Rework and Reballing Equipment

Introducing rework and reballing equipment for safe rework operations in a lead-free environment!

We would like to introduce the rework and reballing equipment we use. The "IR650A Rework System" is a modular type IR rework system designed for safe rework operations in a lead-free environment. Additionally, we have the lead-free compatible "IR550A Plus Rework System" using dynamic IR technology and a "Hybrid Rework System." 【Features (IR650A Rework System)】 ■ Modular type IR rework system ■ Supports safe rework operations in a lead-free environment ■ Compatible with a wide range of delicate mobile phone circuit boards to small PC circuit boards ■ Allows rework operations with simple operating controls *For more details, please refer to the PDF materials or feel free to contact us.

  • Circuit board design and manufacturing
  • Contract manufacturing

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[Presentation of Materials!] Viola Corporation Introduction to Rework and Reballing

Introduction to BGA Rework and Reballing! We are sharing our expertise with over 30,000 rework cases of BGA with a pitch of 0.4 to 0.8mm!

In this document, we introduce the functions of rework and reballing equipment, including BGA rework and reballing. Our company offers BGA replacement, BGA repair, BGA rework, BGA reballing, circuit board modification, circuit board repair, soldering services, and X-ray inspection services with CT functionality. Details of our "BGA Rework and Reballing" include over 30,000 rework achievements for BGA with a pitch of 0.4 to 0.8mm, as well as over 20,000 reballing achievements for BGA with ball diameters ranging from Φ0.2 to 0.8mm. We can also accommodate copper core balls. We can handle requests starting from one piece, and we are capable of working on circuit boards with underfill applied, as well as replacement work for QFN and connectors. Prices are clearly stated, so please feel free to contact us. [Contents] ■ What is rework? ■ What is reballing? ■ The technical capabilities of Viola that meet diverse needs ■ Introduction to some functions of Viola's rework and reballing equipment *For more details, please refer to the PDF document or feel free to contact us.

  • Company:ビオラ
  • Price:Less than 10,000 yen
  • Circuit board design and manufacturing
  • Contract manufacturing
  • Contract Inspection

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